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Date: | Fri, 21 Jun 2002 12:05:56 +0200 |
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Minutes: TDREM 20.06.2002, 14:00
Participants: Ulrich Trunk, Ulrich Uwer, Daniel Baumeister, Sven Loechner,
Harald Deppe, Uwe Stange, Andre Srowig
Beetle:
Sven:
level problem: no commercial bus master forr 2.5volts->
radiation hard levelshifter and bi-directional repeater are
needed for the slow control of beetle
->check with Paolo Moreira for 5V pad
no new measurements of SCTA VELO, but yield problems
due to long metal lines
Daniel:
radiation test of Beetle SR at Tandem accelerator @ MPI
test of two chips
I2C bus scan andparity check in pipeline
preliminary result: about 100 SEU/h
Instability / sensitivity of the setup not understood
Otis:
Harald:
TDC-core
comparators for DLL lock state bit
DLL reset signal independent
DLL layout in one line to save space and routing
fast control
2nd readout mode I2C-interface
boundary scan
AOB
voltage DACs must provide 600uA for ASD-x
self test, memory ( no chequerboard)
readout
data out -> single ended
use DBuffer latch instead additional latch at DBuffer data out
pipeline read access per I2C
IBM .25:
Ulrich:
New Design Kit (1.0.3)
- only supports Cadence 4.4.3
- 4.46 will be supported when available later this year
- New pads with ESD protection (Name: xxx_ESD)
- Slew rate controlled outputs (Name: xxxSxxx)
- 3.3/5V compatible I/O pads available from Paolo Moreira upon
request
- Protection diodes available as single instances
- ESD Design Kit
- Documentation available on
http://deepsub.web.cern.ch/deepsub/
- Tested for electrical but not ESD functionality
- Sim models again up to date with IBM
- DRC rules: density check improved (local filling rules), take
care on
your own!
- CERN has >1 Hercules license
- Format converter Hercules -> Cadence Marker available
Common Cell library
- don't reinvent the wheel.....
- write 1/2 page of description on everything that might be of
interest
for others...
- CERN bandgap reference has problems >1Mrad dose due to leakage
currents
- will be corrected
- 40MHz dual ported SRAM macro block
Yield Experience
BAD ONES
APV25 7x8 20-80% consistent per wafer lot
HAL25 4x11 ~50% probably due to long metal
lines
AtlasPix1 11x7.5 15% (5 met) now much better
(80%)
Atlas RoC 6x4 (5 met) Same run as
AtlasPix1, yield strongly
correlated
GOOD ONES
CMS 6x6, 2x2 >90% after packaging
HPTDC 6.5x6.5 80-90% prototype & engineering
run
AtlasPixel 14x14 >50%
SCAC (Nevis Lab) 90%
- MPW to production is not a smooth ride
- Very large handcrafted designs are unusual in industry
- 1st level of failure analysis is cheap (10kEUR) @ IBM
- Failure of different chips might be different phenomena
- DRC rules in the manual are not sufficient for our designs
IMMEDIATE HELP
- add protection diodes to long lines (0.18 & 0.13 have'em on
every
std. cell!!!)
- increase junction area of transistors driving long lines
- add testability features
- be conservative!!!
- no handle on yield in contract
- commercial products in this process are usually a few % above
the
expected yield
- IBM tries to track down the yield problem to a common
station/machine
in the line
Frame Contract
- covers up to 12Mio SFR, from which at max. 30% can originate
from
CERN
- Ends 1. March 2004, but will be extended
Other stuff:
- Calibre rules for CMOS6SF exist (I will try to get them)
- Package info (chip, pkg & quantity) should be sent to Sandro
- IBM offers Fuses for $20/wafer, which can be laser-blown by IBM
- Only 2 wafers guaranteed per engineering run
- Packaging of the chips only in the EU, US & JP
- MC simulation tool: RAL has a script to do this outside Cadence
Dune:
Andre
charge amp noise (AMS) of 200 electrons factor two higher than
discrete jFET amp
-> verify measurement, consider .13u / .18u process
on trigger -> readout of complete pipeline -> bootle neck ->
storage
time of dynamic analog memory cell up to 1.2ms -> estimate error
due to leakage currents
alternative solutions:
run ADC at input and store digitally -> check powerconsumption
of ADC
digital DBuffer with size of analog pipeline -> overkill
Ulrich Trunk schrieb:
> Agenda of the weekly Tracking Detector Readout Electronics Meeeting,
> 20.06.2002 >>14:00<< ASIC lab meeting room.
>
> Beetle:
> Report fom Lausanne review meeting S.L.
> First impressions from SEU test D.B.
>
> Otis:
> New features for Otis 1.1 H.D.
> Manpower issues all
>
> IBM 0.25:
> Report from London U.T.
> I2C Repeater all
>
> Dune:
> Report from meeting @ MPI A.S.
>
> AOB
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